Printed circuit boards are getting increasingly more complicated, as the electronics industry seeks methods to stay leading in modern technology. The competition to attain more economical solutions in terms of increasing complexity, integrity, optimum functionality, impose on design engineers to look for new horizons of solutions, then simulating and testing them theoretically and practically, before putting them into the labor market.

In multi-layer boards, the issue of maintaining signal quality while transmitting it between different layers arises, it is a big deal, especially when dealing with RF signals, where each component through which the signal passes must be handled and designed with extreme accuracy to be received at output with a maximum matching with the input signal. 

Vertical Interconnect Access (VIA) is the purpose of this thesis. The effect of geometrical shape and the dimensions such as pad, hole and clearance on the impedance due to parasitic capacitance and inductance, consequently on the reflection and attenuation of the passing RF signal passing through was investigated. Besides, a minimized reflection and attenuation was the aim of this project when signals with the frequencies of 2.4 and 5 GHz would pass through the VIA.