hh.sePublications
Change search
Refine search result
1 - 1 of 1
CiteExportLink to result list
Permanent link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Rows per page
  • 5
  • 10
  • 20
  • 50
  • 100
  • 250
Sort
  • Standard (Relevance)
  • Author A-Ö
  • Author Ö-A
  • Title A-Ö
  • Title Ö-A
  • Publication type A-Ö
  • Publication type Ö-A
  • Issued (Oldest first)
  • Issued (Newest first)
  • Created (Oldest first)
  • Created (Newest first)
  • Last updated (Oldest first)
  • Last updated (Newest first)
  • Disputation date (earliest first)
  • Disputation date (latest first)
  • Standard (Relevance)
  • Author A-Ö
  • Author Ö-A
  • Title A-Ö
  • Title Ö-A
  • Publication type A-Ö
  • Publication type Ö-A
  • Issued (Oldest first)
  • Issued (Newest first)
  • Created (Oldest first)
  • Created (Newest first)
  • Last updated (Oldest first)
  • Last updated (Newest first)
  • Disputation date (earliest first)
  • Disputation date (latest first)
Select
The maximal number of hits you can export is 250. When you want to export more records please use the Create feeds function.
  • 1.
    Agelis, Sacki
    et al.
    Halmstad University, School of Information Technology, Halmstad Embedded and Intelligent Systems Research (EIS).
    Jacobsson, Sofia
    Halmstad University, School of Information Technology, Halmstad Embedded and Intelligent Systems Research (EIS).
    Jonsson, Magnus
    Halmstad University, School of Information Technology, Halmstad Embedded and Intelligent Systems Research (EIS).
    Alping, Arne
    Ericsson Microwave Systems, Mölndal, Sweden.
    Ligander, Per
    Ericsson Microwave Systems, Mölndal, Sweden.
    Modular interconnection system for optical PCB and backplane communication2002In: Parallel and Distributed Processing Symposium., Proceedings International, IPDPS 2002, Abstracts and CD-ROM, Los Alamitos, Calif.: IEEE Press, 2002, p. 245-250Conference paper (Refereed)
    Abstract [en]

    This paper presents a way of building modular systems with a powerful optical interconnection network. Each module, placed on a Printed Circuit Board (PCB), has a generic optical communication interface with a simple electronic router. Together with optical switching using micro-electromechanical system (MEMS) technology, packet switching over reconfigurable topologies is possible. The interconnection system gives the possibility to integrate electronics with optics without changing existing PCB technology. Great interest from industry is therefore expected and the cost advantages are several: reuse of module designs, module upgrades without changing the PCB, low-cost conventional PCB technology, etc. In the version described in this paper, the interconnection system has 48 bidirectional optical channels for intra-PCB communication on each board. For inter-PCB communication, a backplane with 192 bidirectional optical channels supports communication between twelve PCBs. With 2.5 Gbit/s per optical channel in each direction, the aggregated intra-PCB bit rate is 120 Gbit/s full duplex (on each PCB) while the aggregated inter-PCB bit rate is 480 Gbit/s full duplex. A case study shows the feasibility of the interconnection system in a parallel processing system for radar signal processing.

1 - 1 of 1
CiteExportLink to result list
Permanent link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf