Purpose - The purpose of this paper is to investigate the effect of the main process parameters of laser melting (LM) type additive manufacturing (AM) on multi-layered structures manufactured from JSC-1A Lunar regolith (Moondust) simulant powder. Design/methodology/approach - Laser diffraction technology was used to analyse and confirm the simulant powder material particle sizes and distribution. Geometrical shapes were then manufactured on a Realizer SLM™ 100 using the simulant powder. The laser-processed samples were analysed via scanning electron microscopy to evaluate surface and internal morphologies, X-ray fluorescence spectroscopy to analyse the chemical composition after processing, and the samples were mechanically investigated via Vickers micro-hardness testing. Findings - A combination of process parameters resulting in an energy density value of 1.011 J/mm² allowed the successful production of components directly from Lunar regolith simulant. An internal relative porosity of 40.8 per cent, material hardness of 670 ±11 HV and a dimensional accuracy of 99.8 per cent were observed in the fabricated samples. Originality/value - This research paper is investigating the novel application of a powder bed fusion AM process category as a potential on-site manufacturing approach for manufacturing structures/components out of Lunar regolith (Moondust). It was shown that this AM process category has the capability to directly manufacture multi-layered parts out of Lunar regolith, which has potential applicability to future moon colonization. © Emerald Group Publishing Limited.

Purpose

This paper aims to explore the potential of ultrasonic additive manufacturing (UAM) to incorporate the direct printing of electrical materials and arrangements (conductors and insulators) at the interlaminar interface of parts during manufacture to allow the integration of functional and optimal electrical circuitries inside dense metallic objects without detrimental effect on the overall mechanical integrity. This holds promise to release transformative device functionality and applications of smart metallic devices and products.

Design/methodology/approach

To ensure the proper electrical insulation between the printed conductors and metal matrices, an insulation layer with sufficient thickness is required to accommodate the rough interlaminar surface which is inherent to the UAM process. This in turn increases the total thickness of printed circuitries and thereby adversely affects the integrity of the UAM part. A specific solution is proposed to optimise the rough interlaminar surface through deforming the UAM substrates via sonotrode rolling or UAM processing.

Findings

The surface roughness (Sa) could be reduced from 4.5 to 4.1 µm by sonotrode rolling and from 4.5 to 0.8 µm by ultrasonic deformation. Peel testing demonstrated that sonotrode-rolled substrates could maintain their mechanical strength, while the performance of UAM-deformed substrates degraded under same welding conditions ( approximately 12 per cent reduction compared with undeformed substrates). This was attributed to the work hardening of deformation process which was identified via dual-beam focussed ion beam–scanning electron microscope investigation.

Originality/value

The sonotrode rolling was identified as a viable methodology in allowing printed electrical circuitries in UAM. It enabled a decrease in the thickness of printed electrical circuitries by ca. 25 per cent. © Emerald Publishing Limited