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The effect of ultrasonic excitation on the electrical properties and microstructure of printed electronic conductive inks
Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, United Kingdom.
Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, United Kingdom.
Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, United Kingdom.ORCID iD: 0000-0002-0480-4079
2015 (English)In: 2015 38th International Spring Seminar on Electronics Technology (ISSE), 2015, p. 140-145Conference paper, Published paper (Refereed)
Abstract [en]

Ultrasonic Additive Manufacturing (UAM) is an advanced manufacturing technique, which enables the embedding of electronic components and interconnections within solid aluminium structures, due to the low temperature encountered during material bonding. In this study, the effects of ultrasonic excitation, caused by the UAM process, on the electrical properties and the microstructure of thermally cured screen printed silver conductive inks were investigated. The electrical resistance and the dimensions of the samples were measured and compared before and after the ultrasonic excitation. The microstructure of excited and unexcited samples was examined using combined Focused Ion Beam and Scanning Electron Microscopy (FIB/SEM) and optical microscopy. The results showed an increase in the resistivity of the silver tracks after the ultrasonic excitation, which was correlated with a change in the microstructure: the size of the silver particles increased after the excitation, suggesting that inter-particle bonding has occurred. The study also highlighted issues with short circuiting between the conductive tracks and the aluminium substrate, which were attributed to the properties of the insulating layer and the inherent roughness of the UAM substrate. However, the reduction in conductivity and observed short circuiting were sufficiently small and rare, which leads to the conclusion that printed conductive tracks can function as interconnects in conjunction with UAM, for the fabrication of novel smart metal components.

Place, publisher, year, edition, pages
2015. p. 140-145
Series
Electronics Technology, International Spring Seminar on, ISSN 2161-2528, E-ISSN 2161-2064
National Category
Embedded Systems
Identifiers
URN: urn:nbn:se:hh:diva-37855DOI: 10.1109/ISSE.2015.7247978ISI: 000374113000029Scopus ID: 2-s2.0-84983208769ISBN: 978-1-4799-8860-0 (electronic)ISBN: 978-1-4799-8859-4 (electronic)OAI: oai:DiVA.org:hh-37855DiVA, id: diva2:1247206
Conference
38th International Spring Seminar on Electronics Technology (ISSE), Eger, Hungary, 6-10 May, 2015
Note

Funding: the Engineering and Physical Science Research Council (EPSRC) as part of the Centre for Innovative Manufacturing in Additive Manufacturing

Available from: 2018-09-11 Created: 2018-09-11 Last updated: 2018-09-28Bibliographically approved

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Friel, Ross J.

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CiteExportLink to record
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Citation style
  • apa
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